首页 > AEC_Q100-010_rev_A

AEC_Q100-010_rev_A

发布时间：来源：文档文库

小中大

字号：

手机查看

AEC-Q100-010-REV-A
July18,2003
AutomotiveElectronicsCouncil
ComponentTechnicalCommittee

ATTACHMENT10

AEC-Q100-010REV-A

SOLDERBALLSHEARTEST

AEC-Q100-010-REV-A
July18,2003
AutomotiveElectronicsCouncil
ComponentTechnicalCommittee

Acknowledgment

Anydocumentinvolvingacomplextechnologybringstogetherexperienceandskillsfrommanysources.TheAutomotiveElectronicsCounselwouldespeciallyliketorecognizethefollowingsignificantcontributorstothedevelopmentofthisdocument:
MajdiMortazaviDaimlerChryslerBrianJendroDaimlerChryslerRobertV.KnoellVisteonCorporationGeraldE.ServaisDelphiDelcoElectronicsSystems-RetiredNickLycoudesMotorolaPhilippeBriotFormerlywithPSA,Peugeot,CitroënMarkGabrielleONSemiconductor

AEC-Q100-010-REV-A
July18,2003
AutomotiveElectronicsCouncil
ComponentTechnicalCommittee

ChangeNotification

ThefollowingsummarydetailsthechangesincorporatedintoAEC-Q100-010Rev-A:

AllSections:Minorrevisionsmadetoallsectionstocorrectformattingerrors.
••
Figures1,2,3andTable2:RevisedFigure1toaddheightparameter.AddednewcaptionstoFigures2&3andTable2.

AEC-Q100-010-REV-A
July18,2003
AutomotiveElectronicsCouncil
ComponentTechnicalCommittee

METHOD-010

SOLDERBALLSHEARTEST

Textenhancementsanddifferencesmadesincethelastrevisionofthisdocumentareshownasunderlinedareas.
1.

SCOPE
Thistestmethodisapplicabletoallsolderballsurfacemountedpackages(e.g.,PBGA,ChipScale,MicroLeadFrameexceptFlipChip.

2.

PURPOSE
Thepurposeofthistestmethodistodefinetheprocedureformeasuringtheshearstrengthoftheinterfacebetweenthebarriermetalandsolderball.Thismethodalsoestablishestheminimumshearstrengthrequirementsforthisinterface.

3.

PROCEDURE
SolderBallShearTestProcedure
Solderballshearshallbeusedtoquantifytheintegrityofthesolderconnectiontothebarriermetallizationonthedevice.Priortosheartesting,thetestsamplesshallbethermally
preconditioned.Theballsforsheartestingshallbechosenrandomlythroughoutthetestunit.
3.1

3.1.1

DetailedBallShearTestProcedure
Thefollowingprocedureshallbeusedforthistest:a.
Placethetestsamplesonacleancircuitboardorceramiccouponpositionedwiththesolderballsideup.Thermallypreconditionthedeviceswithaminimumoftworeflowsusing
convectionorIRreflowwithapeakreflowtemperatureof220+5/-0°CandareflowprofileasdefinedinJ-STD-020(moistureexposureisnotrequired.Allowsamplestocooltoroomtemperature(22±3°C.
Mountthesamplesonasheartester,withthesheararmpositionedataheightof
approximately1/3oftheballheightandnottouchingthesurfaceofthesubstrate,seeFigure1,sheartheballsusingaconstantshearrateof0.28to0.50mm/sec.Recordtheshearstrength.
Usingamicroscopewithaminimum40Xmagnification,examineandrecordtheballseparationmode,seeTable1.
Date
DelphiDelcoElectronicsSystems
DetlefGriessman
Date
VisteonCorporationRobertV.Knoell
Date

b.

c.

d.

DaimlerChryslerMajdiMortazavi

Copyright©2003byDaimlerChrysler,DelphiDelcoElectronicsSystems,andVisteonCorporation.Thisdocumentmaybefreelyreprintedwiththiscopyrightnotice.ThisdocumentcannotbechangedwithoutapprovalbytheAECComponentTechnicalCommittee.

Page1of4

AEC-Q100-010-REV-A
July18,2003
AutomotiveElectronicsCouncil
ComponentTechnicalCommittee

h
?h
SheararmpositionedSheararmpositionedapproximatelyatapproximately1/3oncenterlineofofballheightandnotballandnotcloserthan0.005"tothesubstrate.touchingthesurfaceofthesubstrate.
4.

Figure1:ArmpositionduringSolderBallShear

FAILURECRITERIA
Thefollowingfailurecriteriaarenotvalidfordevicesthathaveundergonestresstesting(beyondthermalpreconditioningorbeendesolderedfromanassembly.

4.1
SolderBallShearAcceptanceCriteria
Solderballshearstrengthshallbe3200gram/mm2(seeFigures2&3andTable2inconjunctionwithacceptableseparationmodes.SeparationmodesaredefinedinTable1.Separationmodes1and4areacceptable.Separationmodes2shallnotexceed5%oftheshearinterface.
Separationmodes3and5arenotacceptable.Evidencethatthesheararmhascontactedthesubstrateduringtheshearingprocessinvalidatestheballshearvalueforthatball.
Table1:DefinitionofSolderBallSeparationModes

SeparationModeDesignation
1
SeparationModeDefinition
Separationoccursthroughthebulksolder.Characterizedbysolderremainingonentiresolderpad.
Separationoccursasafracturethroughthemetal-to-metalbrittleintermetalliclayer(typicallythroughthenickel-tinorgold-tinintermetallic.Thepadtypicallyappearsflatintheseareas.
Separationoccursbetweenthebarriermetallayersunderthebump(typicallyasalossofadhesionbetweenthecopperandnickel.Thepadtypicallyappearsflatintheseareas.
SeparationoccursinthePBGAsubstratematerialbeneaththesolderpadcausingthepadtoripoutorpeelfromthesubstrate.Thesolderballremainsattachedtothepad.
Separationwiththebulkofthesolderseparatingfromthesolderpad,butwiththeplatingremainingonthesolderpad.Thisconditionistypicallyduetoimproperwetting.
Page2of4

2
3
4
5

AEC-Q100-010-REV-A
July18,2003
AutomotiveElectronicsCouncil
ComponentTechnicalCommittee

《AEC_Q100-010_rev_A.doc》

将本文的Word文档下载到电脑，方便收藏和打印

推荐度：

点击下载文档

文档为doc格式

相

关

案

例

AEC_Q100-010_rev_A

相关推荐

推荐内容