![](https://wkrtcs.bdimg.com/rtcs/image?w=264&md5sum=b14eb1e6441b0f2bb4a8a7bf9a082fa7&sign=3065ea6714&rtcs_flag=1&rtcs_ver=3&l=webapp&bucketNum=164&ipr={"t":"img","w":"264","h":"209","dataType":"jpeg","c":"word/media/image1.png","imgOriW":243,"imgOriH":201})
传统工艺
∙ 高热阻(>200 K/W)，低发光效率
∙ 芯片尺寸 < 0.35x0.35mm2
∙ 输入功率＜0.1W
∙ ![](https://wkrtcs.bdimg.com/rtcs/image?w=264&md5sum=b14eb1e6441b0f2bb4a8a7bf9a082fa7&sign=3065ea6714&rtcs_flag=1&rtcs_ver=3&l=webapp&bucketNum=164&ipr={"t":"img","w":"264","h":"183.13333333333","dataType":"jpeg","c":"word/media/image2.png","imgOriW":400,"imgOriH":278})
低发光效率：30%
∙ 在装饰照明上局限性大
∙ 环氧限度为~120℃
倒装焊工艺
∙ ![](https://wkrtcs.bdimg.com/rtcs/image?w=318&md5sum=b14eb1e6441b0f2bb4a8a7bf9a082fa7&sign=3065ea6714&rtcs_flag=1&rtcs_ver=3&l=webapp&bucketNum=164&ipr={"t":"img","w":"318","h":"174","dataType":"png","c":"word/media/image3.png","imgOriW":318,"imgOriH":174})
低热阻~12 K/W
∙ LED芯片尺寸> 1x1mm2
∙ 输入功率 >1 W
∙ 高发光效率~2 X
∙ 高效封装：封装尺寸微型化
∙ 可集成防静电装置
∙ 可组成各种颜色的高功率LED芯片
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